Wire sawing is a method for slicing and cutting silicon wafers, granite, marble and stone. In wire sawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wire sawing is commonly used in the granite and stone cutting industry, silicon wafer production, and other crystal cutting applications.

Washington Mills has been a leading manufacturer of silicon carbide abrasive powder for the wire sawing industry for both solar and semiconductor applications. Silicon carbide for wire sawing can be provided in both green and black and according to ANSI, FEPA or JIS standards. Washington Mills is also able to provide customer distributions, surface chemistry treatments, and particle shape to meet the applications demands.